International MOST Conference and Exhibition
19 April 2016 in Stuttgart/Esslingen, Germany

Webinar 2015

For those who did not have the chance to attend the MOST Forum 2015 or wish to study the conference topics.

Compliance and Quality

A Performance Evaluation Framework for MOST Ethernet Supported by Virtual Prototyping Technology
Prof. Dr. Oliver Bringmann / Alexander Koch / Sebastian Reiter / Prof. Dr. Wolfgang Rosenstiel / Dr. Alexander Viehl, FZI

A Performance Evaluation Framework for MOST Ethernet Supported by Virtual Prototyping Technology
Paper (PDF, 253 KB)
Presentation (PDF, 786 KB)
Speech by Alexander Koch, FZI (11:00)

Specific Test and Simulation Solutions for MOST Streaming Devices
Matthias Karcher, K2L

Specific Test and Simulation Solutions for MOST Streaming Devices
Paper (PDF, 190 KB)
Presentation (PDF, 1 MB)
Speech Matthias Karcher, K2L (21:06)

Network and System Architecture

AUTOSAR Integration for the MOST Network
Dr. Alexander Leonhardi / Nijumohan Rathnalayam, ETAS

AUTOSAR Integration for the MOST Network
Paper (PDF, 292 KB)
Presentation (PDF, 1 MB)
Speech Nijumohan Rathnalayam, ETAS (17:09)

MOST150 Enables New Features
Dr. Wolfgang Bott, MOST Cooperation

MOST150 Enables New Features
Paper (PDF, 251 KB)
Presentation (PDF, 1 MB)
Speech Dr. Wolfgang Bott, MOST Cooperation (24:41)

Lean and Easy Ways to Adopt MOST Technology
Harald Kohler, Microchip Technology

Lean and Easy Ways to Adopt MOST Technology
Paper (PDF, 116 KB)
Presentation (PDF, 1 MB)
Speech Harald Kohler, Microchip Technology (21:29)

Physical Layer

Are you Ready for 5 Gbps Optical?
Carlos Almeida / Markus Dittmann / Claus-Dieter Graeff / Andreas Engel, TE Connectivity

Are you Ready for 5 Gbps Optical?
Paper (PDF, 233 KB)
Presentation (PDF, 1 MB)
Speech Claus-Dieter Graeff and Markus Dittmann, TE Connectivity (18:14)

10 Gbps Physical Layer for Single Twisted-Pair
Dr. Norbert Weber / Conrad Zerna, Fraunhofer IIS

10 Gbps Physical Layer for Single Twisted-Pair
Paper (PDF, 273 KB)
Presentation (PDF, 652 KB)
Speech Conrad Zerna, Fraunhofer IIS (11:33)

RF-through-Plastics: an Alternative to Copper and Optical Fiber
Piet De Pauw / Prof. Patrick Reynaert / Alexander Standaert / Niels Van Thienen / Wouter Volkaerts / Maxime De Wit / Yang Zhang, University of Leuven

RF-through-Plastics: an Alternative to Copper and Optical Fiber
Paper (PDF, 273 KB)
Presentation (PDF, 2 MB)
Speech Prof. Patrick Reynaert, University of Leuven (15:42)

Chip Scale Package Fiber Optic Transceiver Integration for Harsh Environments
Chuck Tabbert, Ultra Communications

Chip Scale Package Fiber Optic Transceiver Integration for Harsh Environments
Paper (PDF, 411 KB)
Presentation (PDF, 1 MB)
Speech Chuck Tabbert, Ultra Communications (9:36)

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